Finesol project combines recent advancements in technological fields such as mechanical and chemical engineering as well as automated control systems and NDT inspection methods, in order to successfully achieve miniaturization of PCBs via the delivery of functional, low cost, hyper-fine solder powders of type 8-9.
FineSol offers an innovative PCB soldering technology that is based on:
1. Production of hyper fined solder powders of type 8-9 (particles size 1-10 μm)
2. Finer interconnects/higher interconnect density thereby increasing functionality per unit size and leading to miniaturization of PCBs
3. Significant saving of raw materials used by reduction in electronics size and weight leading to decrease of cost
4. Reduction in PCB soldering temperatures and dwell time thereby reducing electronics industry carbon footprint and preventing damage of PCB components as well as restriction on the use of rosins in the pastes.
FineSol's three main phases and achievements are:
(a) Development of an upscale prototype atomization machine for production of type 8-9 solder spheres. During the first phase the atomization machine was constructed based on integration of a modified atomization machine of high energy input with a coating sub assembly apparatus for the straight formation of an anti-oxidant protective monolayer coating on the formatted powders.
(b) Formulation of proper solder pastes containing the produced coated solder spheres. Following, solder pastes were produced utilizing appropriate, environmental friendly fluxes, compatible with the organic coating of then solder spheres. The FineSol flux design targeted the development of a solder paste of type 8-9 which exhibits similar properties (printability, compatibility and workability) to the widely used by the PCB manufacturers solder pastes (of type <7), in order to accelerate the adoption of the new FineSol technology by the industry.
(c) Assembly of PCBs in lower reflow temperature compared to the current state of the art by utilizing the produced solder pastes, followed by characterization utilizing NDT methods.
FineSol is a Factories of the Future (FoF) project. This project has received funding from the European Union’s Horizon 2020 research and innovation programme under grant agreement No.680718.